Specifications:

·Alloy Sn96.5Ag3Cu0.5 (96.5% tin, 3% silver and 0.5 copper)

· Melting temperature 217 ° C

· Packaging in 10cc syringe with or without pusher, or in cartridge of 170cc (0.5kg)

· 12% no cleaning flow

· Packaging in 10 cc syringe or 0.5 kg cartridge

The paste or solder paste is used for SMT soldering. It consists of an alloy and a flow whose characteristics are identical to those used for a wave or with an iron.

The alloy is composed of spherical balls whose size from 20 to 160 μm gives the particle size and class.

Classification according to the JEDEC J-STD005 standard:

Class 1, diameter in μm: 150 to 75

Class 2, diameter in μm: 75 to 45

Class 3, diameter in μm: 45 to 20

Class 4, diameter in μm: 38 to 20

Class 5, diameter in μm: 25 to 15

Class 6, diameter in μm: 15 to 5

Class 7, diameter in μm: 11 to 2

Class 8, diameter in μm: 8 to 2

The class allows better control over the quantity and the definition of the deposit in the case of Fine Paste or Fine Pitch.

The syringes are used for a point-by-point deposit (pusher, manual doser, automatic doser).

Pots or cartridges for a silkscreen deposit.