In order to produce a double side printed circuit board with through hole, CIF offers two solutions,
The mechanical technique with rivets inserted into the board and then crimped. Main interest is a cheap process together with high mechanical tolerance. This system is recommended for simple prototypes design with limited eyelets to be inserted.
The second solution is the chemical through hole plating process. It consists of several chemical treatments of the board ending with an electrolytic copper bath treatment. This is the professional process offering best results.
Through hole plating machine METALAB PRO – COMPACTA is a partnership between CIF & WALTER LEMMEN.