Lead free solder paste Sn96.5Ag3Cu0.5 - 10cc syringe - Class 6
Description
Lead free solder paste Sn96.5Ag3Cu0.5 - 10cc syringe - Class 6
- Alloy Sn96.5Ag3Cu0.5 (96.5% tin 3% silver and 0.5 copper)
- Melting temperature 217 ° C
- Packaging in 10cc syringe with or without pusher or in cartridge of 170cc (0.5kg)
- 12% no cleaning flow
- Packaging in 10 cc syringe or 0.5 kg cartridge
Available packaging:
- 10 cc lead-free alloy syringe - Class 5 (ref F42240)
- 10 cc syringe + plunger lead-free alloy - Class 5 (ref F42241)
- 55 cc syringe lead-free alloy - Class 5 (ref V800120)
- Jar of 500g lead free - Class 5 (ref F42243)
- Cartridge 500 gr lead-free - Class 5 (ref F42244)
- 10 cc syringe + plunger lead-free alloy - Class 6 (ref F42245)
- Jar of 500g lead free - Class 6 (ref F42247)
Solder paste Lead-free alloy low temperature liquidus 189 °C
Available packaging:
- Pot of 500g lead-free- Class 5 (ref V800224)
- Cartridge 500 gr lead-free - Class 5 (ref V800225)
- Pot of 500g lead-free - Class 4 (ref V800125)
- Cartridge 500 gr lead-free - Class 4 (ref V800126)
The paste or solder paste is used for SMT soldering. It consists of an alloy and a flow whose characteristics are identical to those used for a wave or with an iron.
The alloy is composed of spherical balls whose size from 20 to 160 μm gives the particle size and class.
Classification according to the JEDEC J-STD005 standard:
Class 1 diameter in μm: 150 to 75
Class 2 diameter in μm: 75 to 45
Class 3 diameter in μm: 45 to 20
Class 4 diameter in μm: 38 to 20
Class 5 diameter in μm: 25 to 15
Class 6 diameter in μm: 15 to 5
Class 7 diameter in μm: 11 to 2
Class 8 diameter in μm: 8 to 2
The class allows better control over the quantity and the definition of the deposit in the case of Fine Paste or Fine Pitch.
The syringes are used for a point-by-point deposit (pusher manual doser automatic doser). Pots or cartridges for a silkscreen deposit.
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