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Vapor phase soldering system VS-500 V

Reference : V900330
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Description

The design of the machine allows to solder even the most complex cards with a format of max. 500 x 500 x 60 mm while ensuring optimal quality thanks to

 

• The inert atmosphere resulting from the fluid (medium) used

• An incomparable temperature delta across the entire component

• No possible handling error during the cycle

 

The upgrades since the VS-500-IV

 

•  A high efficiency chiller included

•  It can go up to 10 temperature levels

•  ESD paint

•  ESD top glass

•  Display of the real-time reflow profile integrated into the machine

•  Light signal column

The main applications relate to lead and lead-free soldering of all types of boards even the most complex conductive adhesives and repair.

 

The concept of the vapor phase allows today

• Reducing fluid consumption (medium) using a unique vapor recovery system; this greatly reduces production costs

• Quick return on investment and high capacity for mixed productions

• Optimum soldering quality in inert atmosphere

• Compensation for pressure fluctuations in the tank

• Minimum temperature delta throughout the working area - not achievable with other technologies

• Reduced energy consumption

• Sub-assembly repair: desoldering and resoldering

• High reliability for all types of soldering

• Precision and repeatability

• Possibility of brazing large format 500 x 500 x 60 mm cards in a small footprint

 

TECHNICAL CHARACTERISTICS

Max PCB dimensions 500 x 500 x 60 mm

Max. Load capacity 2 Kg

Medium capacity 5 Kg

Dimensions (L x l x H) 830 x 775 x 1140 mm

Installed power 7.5 KW / H

Power supply 3 x 400 V + N / 50 Hz


Details

Product dimensions : 775 x 830 x 1140 mm
Package dimensions : 117 x 100 x 137 Centimètre
Gross weight : 305 K
Net weight : 260 K
Brand : CIF
Origin : BE

References

EAN : 3664131051606
NC8 : 85143020

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