CIF and its partner INTERELECTRONIC will be on Booth C05. We will be exposing our Vapor Phase Soldering System A...
Each of the 4 placement heads is equipped with a camera for component recognition, centering and orientation, 1 IC camera and 1 camera for test pattern recognition and alignment Possibility of simultaneous pick-up of 4 components Integrated PCB conveyor Possibility of mounting components on single-sided and double-sided PCB Control of component adhesion