Through hole plating with DCT ProPlating

DCT ProPlating is an application-tested technology designed for through-hole plating of double-sided and multilayer PCBs prototyping. This compact and efficient solution offers a fast and user-friendly operation. It ensures consistent and safe plating results, with excellent thermal stability, making it an ideal solution for achieving through-hole plating on both double-sided and multilayer boards.

HIGHLIGHTS 

• Effortless Prototyping

The DCT ProPlating process, when combined with mechanical CNC drilling (such as Technodrill 3 or DCT DM350/Hybrido), enables easy in-house fabrication of circuit board prototypes within a single day. This approach speeds up time-to-market by eliminating production delays and high costs associated with external ressources, while also ensuring that your valuable design data remains secure and under your control.

• Superior Plating with Advanced Technology

DCT ProPlating leverages specially-developed silver-based plating technology to quickly plate vias as small as 0.4 mm (15 mil) with an aspect ratio of up to 1:4. Even smaller holes can be plated under specific conditions. The entire plating process can be completed in just a few minutes, making it highly efficient for both double-sided and multilayer boards.

• Exceptional Electrical Performance

The electrical resistance of DCT ProPlating vias is exceptionally low, around 20 mΩ, depending on the material thickness, ensuring excellent performance and reliability for your PCB applications.

PROPLATING PROCESS

A specially developed conductive paste (polymer) is used to quickly and efficiently plate vias. The process follows these simple steps: