CIF and its partner INTERELECTRONIC will be on Booth C05. We will be exposing our Vapor Phase Soldering System A...
Blog categories
Search in blog
Latest posts
On April 23, 2024, CIF is organizing a technical day on the subject of board design for selective soldering. The day...
CIF at Global Industrie, interview with Philippe Albrieux Welcome to Majid Jlali, our production machine technician...
Meet us at BOOTH 5V73 Come and see all our new products.
From February 15th to March 31st 2024, Save € 667.00 on your FT03.ADVANCED oven.
SMD Automatic Board Placement Machine - SMT-P4
Features
- Each of the 4 placement heads is equipped with a camera for component recognition, centering and orientation, 1 IC camera and 1 camera for test pattern recognition and alignment
- Possibility of simultaneous pick-up of 4 components
- Integrated PCB conveyor
- Possibility of mounting components on single-sided and double-sided PCB Control of component adhesion
Specifications
- Order No. V900191
- Speed 4,000 to 5,000 comp/h
- Controlled motorization of axes Servomotor, belts with linear encoders
- Number of placement heads 4 heads
- Max. PCB dimensions 570 х 250 mm
- Min. PCB width 50 mm
- Max. component height 15 mm
- Max. number of loaders (8 mm) 44 pcs.
- Feeder type Yamaha, 8, 12, 16, 24, 32 mm
- Component types from 0201 to 40 х 40 mm
- Placement accuracy ±35 μm
- Placement angular accuracy ± 0,15°
- PC OS control under Linux
- Compressed air requirement 6-8 bar, 60 liters/minute
- Power supply 220 V, 50 Hz, single-phase + ground, 800 W
- Machine dimensions (L x W x H) 1120 х 745 х 1415 mm
- Weight 200 kg
Options
Solder cream dispenser Automatic nozzle changeover