Low temperature lead free solder paste ~ 189° - jar of 500g - Class 5
Description
Low temperature lead free solder paste ~ 189° - jar of 500g - Class 5
The paste or solder paste is used for SMT soldering. It consists of an alloy and a flow whose characteristics are identical to those used for a wave or with an iron.
The alloy is composed of spherical balls whose size from 20 to 160 μm gives the particle size and class.
Classification according to the JEDEC J-STD005 standard:
Class 1 diameter in μm: 150 to 75
Class 2 diameter in μm: 75 to 45
Class 3 diameter in μm: 45 to 20
Class 4 diameter in μm: 38 to 20
Class 5 diameter in μm: 25 to 15
Class 6 diameter in μm: 15 to 5
Class 7 diameter in μm: 11 to 2
Class 8 diameter in μm: 8 to 2
The class allows better control over the quantity and the definition of the deposit in the case of Fine Paste or Fine Pitch.
The syringes are used for a point-by-point deposit (pusher manual doser automatic doser).
Pots or cartridges for a silkscreen deposit.
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