You are here :

Low temperature lead free solder paste ~ 189° - jar of 500g - Class 5

Reference : V800224
Contact us

Description

Low temperature lead free solder paste ~ 189° - jar of 500g - Class 5

 

The paste or solder paste is used for SMT soldering. It consists of an alloy and a flow whose characteristics are identical to those used for a wave or with an iron.

The alloy is composed of spherical balls whose size from 20 to 160 μm gives the particle size and class.

 

Classification according to the JEDEC J-STD005 standard:

Class 1 diameter in μm: 150 to 75

Class 2 diameter in μm: 75 to 45

Class 3 diameter in μm: 45 to 20

Class 4 diameter in μm: 38 to 20

Class 5 diameter in μm: 25 to 15

Class 6 diameter in μm: 15 to 5

Class 7 diameter in μm: 11 to 2

Class 8 diameter in μm: 8 to 2

 

The class allows better control over the quantity and the definition of the deposit in the case of Fine Paste or Fine Pitch.

The syringes are used for a point-by-point deposit (pusher manual doser automatic doser).

Pots or cartridges for a silkscreen deposit.

 


Details

Product dimensions : 0 x 0 x 0
Brand : CIF
Origin : FR

References

EAN : 3664131056939
NC8 : 38101000

A question

Newsletter subscription