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Laser system for PCB and Micro-processing - DCT S2

Reference : U900058
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Description

for micro processing variety of material including LTCC/HTCC drilling FPC depaneling thin and tough PCBs (including assembled PCBs) contour cutting coverlayer cutting decap of rigid-flex PCBs cutting complex shapes direct structuring conductive pattern ablating solder resistremoving additional line drilling of ceramics through holes or blind vias drilling on FPC

 

 

Consisting of:

Nano-second laser

Granite X/Y table

Visionsystem with high resolution camera and reflectance light resource

Camera supported positioning system with fiducial recognition

X/Y axises driven by Linear motor

Industrial control PC display keyboard and mouse

Water-cooling unit

Vacuum table for material

Machine driven software: DreamCreTor 3

Data processing software: CircuitCAM 7 Standard

Double safty light curtain

 

 

Technical Data:

Working area (X x Yx Z): 300 mm × 350 mm x 10mm

Accuracy of repeatability: ±2 μm

Laser wavelength: 355 nm

Average output of laser: 15W

Digital scanning galvanometer

TelecentricLense

Resolution of galvanometer: 1 μm

Travelling resolution of X/Y/Z Axis: 1 μm

Weight: approx. 750 kg

Machine Hood dimensions (L/W/H): 1210 mm × 920 mm × 1630 mm

 

Operating conditions:

Power supply: 400/16A or 230V/32A 50 Hz

Main power: 3 kW

Peripherals power: 1.5 kW

Ambient temperature 22° C ± 2° C

Ambient Humidity: <60%

Dry and clean compressed air is required!

Input pressure: 6-8bar air throughput: > 120L/min


Details

Product dimensions : 920 x 1210 x 1630 mm
Gross weight : 900 K
Net weight : 750 K
Brand : DCT
Origin : CN

References

EAN : 3664131051194
NC8 : 84561110

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