Lead-free solder paste
Solder paste Lead-free alloy, low temperature, liquidus 189 °C
The paste or solder paste is used for SMT soldering. It consists of an alloy and a flow whose characteristics are identical to those used for a wave or with an iron.
The alloy is composed of spherical balls whose size from 20 to 160 μm gives the particle size and class.
Classification according to the JEDEC J-STD005 standard:
Class 1, diameter in μm: 150 to 75
Class 2, diameter in μm: 75 to 45
Class 3, diameter in μm: 45 to 20
Class 4, diameter in μm: 38 to 20
Class 5, diameter in μm: 25 to 15
Class 6, diameter in μm: 15 to 5
Class 7, diameter in μm: 11 to 2
Class 8, diameter in μm: 8 to 2
The class allows better control over the quantity and the definition of the deposit in the case of Fine Paste or Fine Pitch.
The syringes are used for a point-by-point deposit (pusher, manual doser, automatic doser). Pots or cartridges for a silkscreen deposit.
No customer comments for the moment.