Hot air level machine - HAL3040, without solder

EP66
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Introduction :

 

.HAL is now affordable to the small entrepreneur & institutions.

.Needs less space & power, less solder dead weight,

.Yet produces consistent high quality leveled boards.

.Microprocessor LCD Control Unit with following controls of a standard HAL :

-10 PCB menu storage

-Fault monitoring & reporting

-Parameter Settings: a) Dip Time b) Air Time c) Solder Temp. d) Auto or Maintenance mode.

 

Specifications:

 

.PCB Size processed : 300 mm x 400 mm

.Enclosure : Stainless Steel

.PCB Holding : Titanium Clamp Holds Boards upto 3 mm Thick

.Solder tank Capacity : 75 Kg.

.Heating time approx : 1 hour

.Size : B 800mm X W 600mm X H 1550 mm

.Shipping Wt.: Without solder 350 kg

 

Facilities Required:

 

.Power : Single / Three Phase, 6k watt, 220v/440v

.Air : 6 to 8 bar 150 NL/ cycle

.Exhaust : 100 mm duct, 1000 m3/h

.Working Area : Minimum 2000 mm X 1250 mm

 

Settings:

 

.Solder temperature 0 to 300°C

.Dip time 0 to 99 sec.

.Air time 0 to 9.9 sec.

.Front & Back air knife Pressure 0 to 4 bar

.Main Air pressure 6 to 8 bar

.Air Knife Orifice 0.2 mm

.Gap between Air knife 10 mm to 15 mm

EP66

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