

Introduction :
.HAL is now affordable to the small entrepreneur & institutions.
.Needs less space & power, less solder dead weight,
.Yet produces consistent high quality leveled boards.
.Microprocessor LCD Control Unit with following controls of a standard HAL :
-10 PCB menu storage
-Fault monitoring & reporting
-Parameter Settings: a) Dip Time b) Air Time c) Solder Temp. d) Auto or Maintenance mode.
Specifications:
.PCB Size processed : 300 mm x 400 mm
.Enclosure : Stainless Steel
.PCB Holding : Titanium Clamp Holds Boards upto 3 mm Thick
.Solder tank Capacity : 75 Kg.
.Heating time approx : 1 hour
.Size : B 800mm X W 600mm X H 1550 mm
.Shipping Wt.: Without solder 350 kg
Facilities Required:
.Power : Single / Three Phase, 6k watt, 220v/440v
.Air : 6 to 8 bar 150 NL/ cycle
.Exhaust : 100 mm duct, 1000 m3/h
.Working Area : Minimum 2000 mm X 1250 mm
Settings:
.Solder temperature 0 to 300°C
.Dip time 0 to 99 sec.
.Air time 0 to 9.9 sec.
.Front & Back air knife Pressure 0 to 4 bar
.Main Air pressure 6 to 8 bar
.Air Knife Orifice 0.2 mm
.Gap between Air knife 10 mm to 15 mm