The design of the machine allows to solder even the most complex cards with a format of max. 500 x 500 x 60 mm while ensuring optimal quality thanks to,

The inert atmosphere resulting from the fluid (medium) used

An incomparable temperature delta across the entire component

No possible handling error during the cycle

The upgrades since the VS-500-IV,

 A high efficiency chiller included

 It can go up to 10 temperature levels

 ESD paint (depending on batches - to be confirmed upon order)

 ESD top glass

 Display of the real-time reflow profile integrated into the machine

 Light signal column

The main applications relate to lead and lead-free soldering of all types of boards even the most complex, conductive adhesives and repair.

The concept of the vapor phase allows today,

Reducing fluid consumption (medium) using a unique vapor recovery system; this greatly reduces production costs

Quick return on investment and high capacity for mixed productions

Optimum soldering quality in inert atmosphere

Compensation for pressure fluctuations in the tank

Minimum temperature delta throughout the working area - not achievable with other technologies

Reduced energy consumption

Sub-assembly repair: desoldering and resoldering

High reliability for all types of soldering

Precision and repeatability

 Possibility of brazing large format 500 x 500 x 60 mm cards in a small footprint

Caractéristiques techniques