Vapor phase reflow oven - VS-500-V

Vapor phase reflow oven VS-500-V

The design of the machine allows to solder even the most complex cards with a format of max. 500 x 500 x 60 mm while ensuring optimal quality thanks to,

  •          The inert atmosphere resulting from the fluid (medium) used
  •          An incomparable temperature delta across the entire component
  •          No possible handling error during the cycle

The upgrades since the VS-500-IV,

  •          A high efficiency chiller included
  •          It can go up to 10 temperature levels
  •          ESD paint
  •          ESD top glass
  •          Display of the real-time reflow profile integrated into the machine
  •          Light signal column 

The main applications relate to lead and lead-free soldering of all types of boards even the most complex, conductive adhesives and repair.

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Description : Vapor phase reflow oven - VS-500-V

Reference : V900330

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Description : Medium (fluid) HS260 - 5 kg

Reference : V800093

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Description : Medium (fluid) HS240 - 5 kg

Reference : V800094

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Description : Medium (fluid) HS 235 - 5 kg

Reference : V800095

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Description : Medium (fluid) LS 230 - 5 kg

Reference : V800096

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Description : Medium (fluid) LS 215 - 5 kg

Reference : V800117

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Description : Medium (fluid) LS 200 - 5 kg

Reference : V800108

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Description : Universal carrier (frame) for VS-500 HD

Reference : V800100

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Description : AGS - Automatic Galden setpoint detection for VS-500

Reference : V800105

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Description : Software update - per update with travel expenses - for VS-500

Reference : V800106

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Description : Cleaning kit

Reference : V700092

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Description : Set of 4 Rolling Feet

Reference : V800099

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Description : Data connection via Ethernet

Reference : V800103

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Description : Multi-language - on request per additional language (standard English)

Reference : V800104

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The concept of the vapor phase allows today,

  •          Reducing fluid consumption (medium) using a unique vapor recovery system; this greatly reduces production costs
  •          Quick return on investment and high capacity for mixed productions
  • •       Optimum soldering quality in inert atmosphere
  •          Compensation for pressure fluctuations in the tank
  •          Minimum temperature delta throughout the working area - not achievable with other technologies
  •          Reduced energy consumption
  • •       Sub-assembly repair: desoldering and resoldering
  • •       High reliability for all types of soldering
  • •       Precision and repeatability
  •         Possibility of brazing large format 500 x 500 x 60 mm cards in a small footprint

    

Technical characteristics

Max PCB dimensions500 x 500 x 60 mm
Max. Load capacity2 Kg
Medium capacity5 Kg
Dimensions (L x l x H)830 x 775 x 1140 mm
Installed power7.5 KW / H
Power supply3 x 400 V + N / 50 Hz

     

Working Principle





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Vapor phase reflow oven - VS-500-V

Vapor phase reflow oven - VS-500-V

Vapor phase reflow oven VS-500-V

The design of the machine allows to solder even the most complex cards with a format of max. 500 x 500 x 60 mm while ensuring optimal quality thanks to,

  •          The inert atmosphere resulting from the fluid (medium) used
  •          An incomparable temperature delta across the entire component
  •          No possible handling error during the cycle

The upgrades since the VS-500-IV,

  •          A high efficiency chiller included
  •          It can go up to 10 temperature levels
  •          ESD paint
  •          ESD top glass
  •          Display of the real-time reflow profile integrated into the machine
  •          Light signal column 

The main applications relate to lead and lead-free soldering of all types of boards even the most complex, conductive adhesives and repair.

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