

Lead free solder paste Sn96.5Ag3Cu0.5 - 10cc syringe - Class 6
. Alloy Sn96.5Ag3Cu0.5
. Melting temperature 217 ° C
. Packaging in 10cc syringe with or without pusher, or in cartridge of 170cc
. 12% no cleaning flow
. Packaging in 10 cc syringe or 0.5 kg cartridge
Available packaging:
- 10 cc lead-free alloy syringe - Class 5
- 10 cc syringe + plunger, lead-free alloy - Class 5
- 55 cc syringe, lead-free alloy - Class 5
- Jar of 500g, lead free - Class 5
- Cartridge 500 gr, lead-free - Class 5
- 10 cc syringe + plunger, lead-free alloy - Class 6
- Jar of 500g, lead free - Class 6
Solder paste Lead-free alloy, low temperature, liquidus 189 °C
Available packaging:
- Pot of 500g, lead-free- Class 5
- Cartridge 500 gr, lead-free - Class 5
- Pot of 500g, lead-free - Class 4
- Cartridge 500 gr, lead-free - Class 4
The paste or solder paste is used for SMT soldering. It consists of an alloy and a flow whose characteristics are identical to those used for a wave or with an iron.
The alloy is composed of spherical balls whose size from 20 to 160 µm gives the particle size and class.
Classification according to the JEDEC J-STD005 standard:
Class 1, diameter in µm: 150 to 75
Class 2, diameter in µm: 75 to 45
Class 3, diameter in µm: 45 to 20
Class 4, diameter in µm: 38 to 20
Class 5, diameter in µm: 25 to 15
Class 6, diameter in µm: 15 to 5
Class 7, diameter in µm: 11 to 2
Class 8, diameter in µm: 8 to 2
The class allows better control over the quantity and the definition of the deposit in the case of Fine Paste or Fine Pitch.
The syringes are used for a point-by-point deposit