Polyimide film with copperfoil

AS
Quantité : 1
Nombre de face : 1 face
Epaisseur du substrat : 5/100mm
Epaisseur de cuivre : 35µ
Format PCB : 100x150
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Polyimide film with copperfoil on one or both sides, bonded together with aproprietary C-staged modified acrylic adhesive.

Raw, non-presensitised.

Dielectric constant 3.6 - 3.8

Dimensional stability ± 0.15%

Peel strength 0.8 N/mm

AN05

Specific References

ean13
3664131002622

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