Hot air level machine - HAL3040, without solder
Introduction :
·HAL is now affordable to the small entrepreneur & institutions.
·Needs less space & power, less solder dead weight,
·Yet produces consistent high quality leveled boards.
·Microprocessor LCD Control Unit with following controls of a standard HAL :
-10 PCB menu storage
-Fault monitoring & reporting
-Parameter Settings: a) Dip Time b) Air Time c) Solder Temp. d) Auto or Maintenance mode.
Specifications:
·PCB Size processed : 300 mm x 400 mm
·Enclosure : Stainless Steel
·PCB Holding : Titanium Clamp Holds Boards upto 3 mm Thick
·Solder tank Capacity : 75 Kg.
·Heating time approx : 1 hour
·Size : B 800mm X W 600mm X H 1550 mm
·Shipping Wt.: Without solder 175 kg
Facilities Required:
·Power : Single / Three Phase, 6k watt, 220v/440v
·Air : 6 to 8 bar 150 NL/ cycle
·Exhaust : 100 mm duct, 1000 m3/h
·Working Area : Minimum 2000 mm X 1250 mm
Settings:
·Solder temperature 0 to 300°C
·Dip time 0 to 99 sec.
·Air time 0 to 9.9 sec.
·Front & Back air knife Pressure 0 to 4 bar
·Main Air pressure 6 to 8 bar
·Air Knife Orifice 0.2 mm
·Gap between Air knife 10 mm to 15 mm