Laser system for PCB and Micro-processing - DCT S2
for micro processing variety of material, including LTCC/HTCC drilling, FPC depaneling, thin and tough PCBs (including assembled PCBs) contour cutting, coverlayer cutting, decap of rigid-flex PCBs, cutting complex shapes, direct structuring conductive pattern, ablating solder resist,removing additional line, drilling of ceramics, through holes or blind vias drilling on FPC
Consisting of:
Nano-second laser
Granite X/Y table
Visionsystem with high resolution camera and reflectance light resource
Camera supported positioning system with fiducial recognition
X/Y axises driven by Linear motor
Industrial control PC, display, keyboard and mouse
Water-cooling unit
Vacuum table for material
Machine driven software: DreamCreTor 3
Data processing software: CircuitCAM 7 Standard
Double safty light curtain
Technical Data:
Working area (X x Yx Z): 300 mm × 350 mm x 10mm
Accuracy of repeatability: ±2 μm
Laser wavelength: 355 nm
Average output of laser: 15W
Digital scanning galvanometer
TelecentricLense
Resolution of galvanometer: 1 μm
Travelling resolution of X/Y/Z Axis: 1 μm
Weight: approx. 750 kg
Machine Hood dimensions (L/W/H): 1210 mm × 920 mm × 1630 mm
Operating conditions:
Power supply: 400/16A or 230V/32A 50 Hz
Main power: 3 kW
Peripherals power: 1.5 kW
Ambient temperature 22° C ± 2° C
Ambient Humidity: <60%
Dry and clean compressed air is required!
Input pressure: 6-8bar, air throughput: > 120L/min